Printing apparatus and printing method of bonding material

Patent name: Printing apparatus for joining materials and printing method Patent applicant Matsushita Electric Industrial Co., Ltd. Main applicant address Inventor of Osaka Prefecture, Japan Koji Yoshiyuki; Yamauchi Dai; Shirai Shii; Shinji Yamauchi; Fujita Yoshiyuki; Iwasaki Masaki Application (Patents No. 200410085952.4 Application date 2004.10.25 Award date Approval announcement number 1663794 Validation announcement date 2005.09.07 Manual CD-ROM number D0536 Main classification number B41F15/08 Classification number B41F15/08; H05K3/34; H05K13/04 Division Original application number Priority Item 2004.3.5 JP 2004-061772 Abstract The present invention provides a printing apparatus and a printing method for a bonding material, wherein a side surface supporting substrate is mounted by a component on which a plurality of components are mounted, and the surface of the side surface of the mounting surface of the substrate is opposite to that of the substrate. Printing is performed on the facing surface, that is, the working-side surface, of the bonding material, and an edge area of ​​the substrate that has been supported by the board conveying portion is included in the support area of ​​the board at the time of the printing, so that the extension is mounted with high density. The above-mentioned supporting area of ​​the above-mentioned substrate of the component and achieves a reliable and highly accurate bonding Printed materials. SATUM 1. A method for printing a bonding material, in which a side surface supporting substrate is mounted on a component to which a plurality of components are mounted, and a component is bonded to a surface opposite to the component mounting side surface of the substrate, that is, a working surface. The printing of the material is characterized in that the supported substrate is carried into the printing operation area while supporting at least the edge of the surface of the component mounting side of the substrate by the substrate conveying section, and the above-mentioned printing operation area is released The substrate conveying portion suctions and holds the region including at least the edge portion of the component mounting side surface of the substrate while supporting the substrate, and maintains the supporting posture of the substrate, and the substrate holding the supporting posture is supported. The work side surface is printed on the joining material. International Application International Publication Date of Entry into the Country Patent Agency Organizational Patent and Trademark Agency Co., Ltd. Agency Address Agent Wang Huimin