Japan’s Sanyo Electric and Sanyo AQUA Technologies have jointly developed a sewage treatment facility “Slurry Closer†which is used to process waste water discharged from the semiconductor factory production process at a low cost.
"Slurry Closer" is mainly used to process the sewage discharged from the chemical mechanical polishing (CMP) process. The CMP process refers to the use of an abrasive cloth to grind the surface of the silicon wafer, since the slurry containing gold grits is used as an abrasive. Therefore, the discharged effluent contains gold grit with a diameter of several tens of nanometers and debris that is ground off the surface of the silicon wafer.
This waste water was treated in the same way as the waste water in other semiconductor manufacturing processes by cohesive precipitation and filtration. However, since a large amount of aggregating agent must be used, and the filter also forms a mesh clogging, the working efficiency is low and the cost is high.
Sanyo Electric and other companies have independently developed ultra-low pressure filtration technology using an immersed flat membrane. The use of CMP drainage on the filter produces a gel layer that can be efficiently and accurately separated into water and particles. Not only is the processing cost drastically reduced, but also particles that are likely to be used as recycled resources can be recovered.
In the future, Sanyo Electric and other companies will jointly develop the reuse and use of recovered solid particles with Prof. Nakamura Kasei of the Tohoku University’s Institute of Multi-Materials Science.
"Slurry Closer" is mainly used to process the sewage discharged from the chemical mechanical polishing (CMP) process. The CMP process refers to the use of an abrasive cloth to grind the surface of the silicon wafer, since the slurry containing gold grits is used as an abrasive. Therefore, the discharged effluent contains gold grit with a diameter of several tens of nanometers and debris that is ground off the surface of the silicon wafer.
This waste water was treated in the same way as the waste water in other semiconductor manufacturing processes by cohesive precipitation and filtration. However, since a large amount of aggregating agent must be used, and the filter also forms a mesh clogging, the working efficiency is low and the cost is high.
Sanyo Electric and other companies have independently developed ultra-low pressure filtration technology using an immersed flat membrane. The use of CMP drainage on the filter produces a gel layer that can be efficiently and accurately separated into water and particles. Not only is the processing cost drastically reduced, but also particles that are likely to be used as recycled resources can be recovered.
In the future, Sanyo Electric and other companies will jointly develop the reuse and use of recovered solid particles with Prof. Nakamura Kasei of the Tohoku University’s Institute of Multi-Materials Science.
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